Inventor

ESPIRITU EMMANUEL

SG41 patents

⚠️ This page may combine multiple inventors who share the name “ESPIRITU EMMANUEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ESPIRITU EMMANUEL

CAMACHO ZIGMUND RAMIREZ

Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof

Integrated circuit packaging system with interposer structure and method of manufacture thereof

Integrated circuit packaging system with leads and method of manufacturing thereof

Integrated circuit packaging system with island terminals and method of manufacture thereof

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with interlock and method of manufacture thereof

Integrated circuit packaging system with interlock and method of manufacture thereof

Integrated circuit packaging system with locking interconnects and method of manufacture thereof

Integrated circuit packaging system with multi-row leads and method of manufacture thereof

Integrated circuit packaging system with shaped lead and method of manufacture thereof

Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof

Integrated circuit packaging system with leads and method of manufacture thereof

Integrated circuit packaging system with bumps and method of manufacture thereof

Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof

Integrated circuit packaging system with connection supports and method of manufacture thereof

Integrated circuit packaging system with dual connection and method of manufacture thereof

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Integrated circuit packaging system with lead interlocking mechanisms and method of manufacture thereof

Integrated circuit packaging system with paddle molding and method of manufacture thereof

Integrated circuit packaging system with an intermediate pad and method of manufacture thereof

Integrated circuit packaging system with die paddles and method of manufacture thereof

ESPIRITU EMMANUEL

Integrated circuit package system with heatspreader

Integrated circuit packaging system with plated leads and method of manufacture thereof

Integrated circuit packaging system with coreless substrate and method of manufacture thereof

Integrated circuit packaging system with lead frame and method of manufacture thereof

Integrated circuit packaging system with a lead and method of manufacture thereof

BATHAN HENRY DESCALZO

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with protective coating and method of manufacture thereof

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with array contacts and method of manufacture thereof

STATS CHIPPAC LTD

Stacked integrated circuits package system with passive components

Integrated circuit package-in-package system

Integrated circuit heat spreader stacking method

DO BYUNG TAI

Integrated circuit packaging system with side solderable leads and method of manufacture thereof

Integrated circuit packaging system with planarity control and method of manufacture thereof

FILOTEO JR DARIO S

Integrated circuit package system having interconnect stack and external interconnect

Integrated circuit heat spreader stacking system

UTAC HEADQUARTERS PTE LTD

Semiconductor device and method of forming an optical semiconductor package with a shield structure

Reliable semiconductor packages

STATS CHIPPAC PTE LTD

Integrated circuit packaging system with interposer structure and method of manufacture thereof

SHIM IL KWON

Integrated circuit package system with bonding in via