Inventor
KASAI MASAKI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “KASAI MASAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ROHM CO LTD
11 patentsUS7714448B2May 11, 2010
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD13 citations92
US9601441B2Mar 21, 2017
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD4 citations84
US9312228B2Apr 12, 2016
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD4 citations84
US9111819B2Aug 18, 2015
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD4 citations84
US8928156B2Jan 6, 2015
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD4 citations84
US8786106B2Jul 22, 2014
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD4 citations84
US11069591B2Jul 20, 2021
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD2 citations73
US10431516B2Oct 1, 2019
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD2 citations73
US12057362B2Aug 6, 2024
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD0 citations62
US9018762B2Apr 28, 2015
Semiconductor device bonding with stress relief connection pads
ROHM CO LTD0 citations52
US8723339B2May 13, 2014
Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus
ROHM CO LTD0 citations52
KASAI MASAKI
3 patentsUS8446008B2May 21, 2013
Semiconductor device bonding with stress relief connection pads
KASAI MASAKI5 citations71
US8164201B2Apr 24, 2012
Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus
KASAI MASAKI3 citations60
US8664779B2Mar 4, 2014
Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus
KASAI MASAKI0 citations50