Inventor
MIYATA OSAMU
JP55 patents
⚠️ This page may combine multiple inventors who share the name “MIYATA OSAMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ROHM CO LTD
33 patentsUS7436063B2Oct 14, 2008
Packaging substrate and semiconductor device
ROHM CO LTD70 citations98
US6607135B1Aug 19, 2003
Module for IC card, IC card, and method for manufacturing module for IC card
ROHM CO LTD117 citations98
US6160526ADec 12, 2000
IC module and IC card
ROHM CO LTD112 citations98
US6133637AOct 17, 2000
Semiconductor device having a plurality of semiconductor chips
ROHM CO LTD283 citations98
US6207473B1Mar 27, 2001
Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and IC card
ROHM CO LTD70 citations96
US6204564B1Mar 20, 2001
Semiconductor device and method for making the same
ROHM CO LTD63 citations96
US7598613B2Oct 6, 2009
Flip chip bonding structure
ROHM CO LTD44 citations93
US7714448B2May 11, 2010
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD13 citations92
US6458609B1Oct 1, 2002
Semiconductor device and method for manufacturing thereof
ROHM CO LTD36 citations92
US6308894B1Oct 30, 2001
IC module, method of manufacturing the same and IC card provided with IC module
ROHM CO LTD49 citations92
US9601441B2Mar 21, 2017
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD4 citations84
US9312228B2Apr 12, 2016
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD4 citations84
US9111819B2Aug 18, 2015
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD4 citations84
US8928156B2Jan 6, 2015
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD4 citations84
US8786106B2Jul 22, 2014
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD4 citations84
US7456049B2Nov 25, 2008
Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same
ROHM CO LTD9 citations84
US7456502B2Nov 25, 2008
Wiring board with connection electrode formed in opening and semiconductor device using the same
ROHM CO LTD7 citations74
US5672550ASep 30, 1997
Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame
ROHM CO LTD13 citations74
US11069591B2Jul 20, 2021
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD2 citations73
US10431516B2Oct 1, 2019
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD2 citations73
US11842972B2Dec 12, 2023
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD1 citations63
US11355462B2Jun 7, 2022
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations63
US8659174B2Feb 25, 2014
Semiconductor device
ROHM CO LTD3 citations63
US7518230B2Apr 14, 2009
Semiconductor chip and semiconductor device
ROHM CO LTD4 citations63
US7405485B2Jul 29, 2008
Semiconductor device
ROHM CO LTD4 citations63
US12057362B2Aug 6, 2024
Semiconductor device and method for manufacturing semiconductor device
ROHM CO LTD0 citations62
US10818628B2Oct 27, 2020
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US10522494B2Dec 31, 2019
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US9831204B2Nov 28, 2017
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US9721865B2Aug 1, 2017
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US9117774B2Aug 25, 2015
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US8754535B2Jun 17, 2014
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US8723339B2May 13, 2014
Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus
ROHM CO LTD0 citations52
MIYATA OSAMU
4 patentsUS8432046B2Apr 30, 2013
Semiconductor device
MIYATA OSAMU24 citations92
US8653657B2Feb 18, 2014
Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device
MIYATA OSAMU5 citations72
US8575764B2Nov 5, 2013
Semiconductor device and method for manufacturing semiconductor device
MIYATA OSAMU4 citations72
US8063495B2Nov 22, 2011
Semiconductor device
MIYATA OSAMU4 citations62
STANLEY ELECTRIC CO LTD
4 patentsUS5055993AOct 8, 1991
Invertor apparatus
STANLEY ELECTRIC CO LTD27 citations92
US6404142B2Jun 11, 2002
Starting device for discharge lamp
STANLEY ELECTRIC CO LTD11 citations72
US7688008B2Mar 30, 2010
Lighting lamp
STANLEY ELECTRIC CO LTD2 citations63
US6467941B1Oct 22, 2002
Vehicle lighting unit
STANLEY ELECTRIC CO LTD4 citations58
TLV CO LTD
3 patentsMITSUBISHI MOTORS CORP
2 patentsTANIDA KAZUMASA
1 patentKASAI MASAKI
1 patentHITACHI FERRITE ELECT LTD
1 patentNISHI NIPPON ELEC WIRE & CABLE
1 patentShowing the top 50 of 55 patents by PatentIndex Score.