Inventor

NOH HYUNGGYUN

KR3 patents

Patents

3 patents

US11735491B2Aug 22, 2023

Semiconductor package device

SAMSUNG ELECTRONICS CO LTD0 citations50

US11961824B2Apr 16, 2024

Semiconductor package including stacked chip structure

SAMSUNG ELECTRONICS CO LTD1 citations49

US12568822B2Mar 3, 2026

Semiconductor module including a clip structure

SAMSUNG ELECTRONICS CO LTD0 citations45