Inventor

MUTHUKUMAR SRIRAM

US31 patents

⚠️ This page may combine multiple inventors who share the name “MUTHUKUMAR SRIRAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MUTHUKUMAR SRIRAM

INTEL CORP

Method of stiffening coreless package substrate

Metal-metal bonding of compliant interconnect

Thin silicon based substrate

Method of manufacturing of thin based substrate

Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias

Multi-chip packaging using an interposer with through-vias

Compliant interconnects for semiconductors and micromachines

Thin silicon based substrate

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Integrated inductors and compliant interconnects for semiconductor packaging

Metal-metal bonding of compliant interconnect

High performance integrated inductor

Integrated WLUF and SOD process

ENLISENSE LLC

Biosensing system and methods using electron-ionic mechanisms at fluid-sensor interfaces

Wearable biosensors with room temperature ionic liquid buffer

Multi-configurable sensing array and methods of using same

Systems and methods for multi-modal and multiplexed electrochemical detection and reporting of environmental contaminants

High density analog multipexing

MUTHUKUMAR SRIRAM

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Compliant multi-composition interconnects

Method of stiffening coreless package substrate

Methods for making multi-chip packaging using an interposer

UNIV RUTGERS

Schottky diode with silver layer contacting the ZnO and MgxZn1-xO films

Zinc oxide nanotip and fabricating method thereof

Schottky diode with silver layer contacting the ZnO and MgxZn1−xO films

KARPUR PRASANNA

Methods and apparatuses to stiffen integrated circuit package

Methods and apparatuses to stiffen integrated circuit package

MAXIM INTEGRATED PRODUCTS

Warpage compensation metal for wafer level packaging technology

Wafer level device and method with cantilever pillar structure

ALTERA CORP

Look-up table overdrive circuits

MAHMUD RUBAYAT

Integrated WLUF and SOD process