Inventor
WATTS NICHOLAS R
US18 patents
⚠️ This page may combine multiple inventors who share the name “WATTS NICHOLAS R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS7183653B2Feb 27, 2007
Via including multiple electrical paths
INTEL CORP62 citations94
US7851269B2Dec 14, 2010
Method of stiffening coreless package substrate
INTEL CORP16 citations92
US6556453B2Apr 29, 2003
Electronic circuit housing with trench vias and method of fabrication therefor
INTEL CORP26 citations92
US10607976B2Mar 31, 2020
Offset interposers for large-bottom packages and large-die package-on-package structures
INTEL CORP6 citations83
US12107082B2Oct 1, 2024
Offset interposers for large-bottom packages and large-die package-on-package structures
INTEL CORP2 citations72
US11978730B2May 7, 2024
Offset interposers for large-bottom packages and large-die package-on-package structures
INTEL CORP1 citations72
US11798932B2Oct 24, 2023
Offset interposers for large-bottom packages and large-die package-on-package structures
INTEL CORP1 citations72
US9780054B2Oct 3, 2017
Semiconductor package with embedded die and its methods of fabrication
INTEL CORP2 citations72
US7952202B2May 31, 2011
Method of embedding passive component within via
INTEL CORP4 citations71
US7275316B2Oct 2, 2007
Method of embedding passive component within via
INTEL CORP9 citations71
US9960079B2May 1, 2018
Passive within via
INTEL CORP1 citations60
US7737025B2Jun 15, 2010
Via including multiple electrical paths
INTEL CORP2 citations59