Inventor

SINGH SARAVJEET

US55 patents

⚠️ This page may combine multiple inventors who share the name “SINGH SARAVJEET”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SINGH SARAVJEET

APPLIED MATERIALS INC

Shaping a plasma with a magnetic field to control etch rate uniformity

Wafer dicing using femtosecond-based laser and plasma etch

Laser, plasma etch, and backside grind process for wafer dicing

Auxiliary electrode encased in cation exchange membrane tube for electroplating cell

Electroplating apparatus and method based on an array of anodes

Wafer dicing used hybrid multi-step laser scribing process with plasma etch

Direct lift process apparatus

Electrochemical processing cell

Multi-zone gas distribution systems and methods

Multi-plate faceplate for a processing chamber

Methods and systems to enhance process uniformity

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Gas distribution apparatus for directional and proportional delivery of process gas to a process chamber

Multi-step and asymmetrically shaped laser beam scribing

Laser scribing and plasma etch for high die break strength and clean sidewall

Ceramic showerheads with conductive electrodes

Ceramic showerheads with conductive electrodes

Multi-zone gas distribution systems and methods

Systems and methods for improved performance in semiconductor processing

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing from wafer backside

Wafer dicing using hybrid multi-step laser scribing process with plasma etch

Two piece electrode assembly with gap for plasma control

Methods and systems to enhance process uniformity

Two piece electrode assembly with gap for plasma control

Wafer dicing with etch chamber shield ring for film frame wafer applications

Ceramic showerheads with conductive electrodes

Multi-zone gas distribution systems and methods

Wafer dicing using femtosecond-based laser and plasma etch

Laser and plasma etch wafer dicing using water-soluble die attach film

LEI WEI-SHENG

Wafer dicing using femtosecond-based laser and plasma etch

Laser and plasma etch wafer dicing using water-soluble die attach film

Water soluble mask for substrate dicing by laser and plasma etch

Multi-step and asymmetrically shaped laser beam scribing

Water soluble mask for substrate dicing by laser and plasma etch

Wafer dicing using hybrid split-beam laser scribing process with plasma etch

Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch

Method of diced wafer transportation

SINGH SARAVJEET

Dynamic ion radical sieve and ion radical aperture for an inductively coupled plasma (ICP) reactor

Method and apparatus for fast gas exchange, fast gas switching, and programmable gas delivery

Apparatus and methods for dry etch with edge, side and back protection

Hybrid laser and plasma etch wafer dicing using substrate carrier

YALAMANCHILI MADHAVA RAO

In-situ deposited mask layer for device singulation by laser scribing and plasma etch

HOLDEN JAMES M

Multi-layer mask for substrate dicing by laser and plasma etch

NANGOY ROY C

Method and apparatus for high efficiency gas dissociation in inductive couple plasma reactor

DINEV JIVKO

High efficiency gas dissociation in inductively coupled plasma reactor with improved uniformity