Inventor
CRUSE JAMES P
US32 patents
⚠️ This page may combine multiple inventors who share the name “CRUSE JAMES P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
14 patentsUS7955646B2Jun 7, 2011
Elimination of flow and pressure gradients in low utilization processes
APPLIED MATERIALS INC381 citations99
US5910011AJun 8, 1999
Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system
APPLIED MATERIALS INC161 citations99
US7968469B2Jun 28, 2011
Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity
APPLIED MATERIALS INC46 citations94
US6660659B1Dec 9, 2003
Plasma method and apparatus for processing a substrate
APPLIED MATERIALS INC44 citations93
US6652710B2Nov 25, 2003
Process monitoring apparatus and method
APPLIED MATERIALS INC18 citations92
US7988815B2Aug 2, 2011
Plasma reactor with reduced electrical skew using electrical bypass elements
APPLIED MATERIALS INC11 citations84
US7879731B2Feb 1, 2011
Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources
APPLIED MATERIALS INC13 citations84
US7645709B2Jan 12, 2010
Methods for low temperature oxidation of a semiconductor device
APPLIED MATERIALS INC13 citations84
US7605008B2Oct 20, 2009
Plasma ignition and complete faraday shielding of capacitive coupling for an inductively-coupled plasma
APPLIED MATERIALS INC11 citations84
US7552736B2Jun 30, 2009
Process for wafer backside polymer removal with a ring of plasma under the wafer
APPLIED MATERIALS INC9 citations84
US7994872B2Aug 9, 2011
Apparatus for multiple frequency power application
APPLIED MATERIALS INC6 citations74
US8895889B2Nov 25, 2014
Methods and apparatus for rapidly responsive heat control in plasma processing devices
APPLIED MATERIALS INC2 citations63
US7884025B2Feb 8, 2011
Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources
APPLIED MATERIALS INC4 citations63
US9587789B2Mar 7, 2017
Methods and apparatus for providing a gas mixture to a pair of process chambers
APPLIED MATERIALS INC0 citations52
CRUSE JAMES P
8 patentsUS8496756B2Jul 30, 2013
Methods for processing substrates in process systems having shared resources
CRUSE JAMES P518 citations98
US8707754B2Apr 29, 2014
Methods and apparatus for calibrating flow controllers in substrate processing systems
CRUSE JAMES P10 citations80
US8931512B2Jan 13, 2015
Gas delivery system and method of use thereof
CRUSE JAMES P5 citations72
US8473247B2Jun 25, 2013
Methods for monitoring processing equipment
CRUSE JAMES P5 citations71
US8721798B2May 13, 2014
Methods for processing substrates in process systems having shared resources
CRUSE JAMES P2 citations62
US8454756B2Jun 4, 2013
Methods for extending the lifetime of pressure gauges coupled to substrate process chambers
CRUSE JAMES P2 citations62
US8616043B2Dec 31, 2013
Methods and apparatus for calibrating pressure gauges in a substrate processing system
CRUSE JAMES P0 citations41
US8144329B2Mar 27, 2012
Low power RF tuning using optical and non-reflected power methods
CRUSE JAMES P0 citations34
ZHANG CHUNLEI
2 patentsCOLLINS KENNETH S
2 patentsUS8076247B2Dec 13, 2011
Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes
COLLINS KENNETH S11 citations83
US8080479B2Dec 20, 2011
Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator
COLLINS KENNETH S6 citations73