Inventor
JIANG SHIN-SHING
TW4 patents
Patents
4 patentsUS7443272B2Oct 28, 2008
Signal transmission structure, circuit board and connector assembly structure
VIA TECH INC13 citations82
US7485966B2Feb 3, 2009
Via connection structure with a compensative area on the reference plane
VIA TECH INC3 citations60
US7436268B2Oct 14, 2008
Signal transmission structure, circuit board and connector assembly structure
VIA TECH INC3 citations60
US7247937B2Jul 24, 2007
Mounting pad structure for wire-bonding type lead frame packages
VIA TECH INC6 citations60