Inventor

KAO HUAHUNG

US29 patents

⚠️ This page may combine multiple inventors who share the name “KAO HUAHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KAO HUAHUNG

MARVELL INT LTD

Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types

Leadless multi-chip module structure

Pre-formed conductive bumps on bonding pads

Leadframe with improved half-etch layout to reduce defects caused during singulation

Leadless multi-chip module structure

Pillar structure on bump pad

Drop-in heat sink and exposed die-back for molded flip die package

Leadless multi-chip module structure

Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types

Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types

Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types

MARVELL WORLD TRADE LTD

Stack die packages

Package-on-package structures

Stack die packages

Pad configurations for an electronic package assembly

Pad configurations for an electronic package assembly

Single layer BGA substrate process

KAO HUAHUNG

Package-on-package structures

Stack die structure for stress reduction and facilitation of electromagnetic shielding

Interconnect layouts for electronic assemblies

MARVELL ASIA PTE LTD

Heat sink design for flip chip ball grid array

Decoupling capacitor integrated in system on chip (SOC) device

Packaging stacked substrates and an integrated circuit die using a lid and a stiffening structure

LIOU SHIANN-MING

Pre-formed conductive bumps on bonding pads

Single layer BGA substrate process

SUTARDJA SEHAT

Pad configurations for an electronic package assembly

LOEB WAYNE

Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types

LEISTIKO TYSON

Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types

LIU CHENGLIN

Formation of package pins in semiconductor packaging