Inventor
DENG JACK
TW4 patents
⚠️ This page may combine multiple inventors who share the name “DENG JACK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
3 patentsUS7264976B2Sep 4, 2007
Advance ridge structure for microlens gapless approach
TAIWAN SEMICONDUCTOR MFG19 citations82
US7505206B2Mar 17, 2009
Microlens structure for improved CMOS image sensor sensitivity
TAIWAN SEMICONDUCTOR MFG14 citations81
US7507598B2Mar 24, 2009
Image sensor fabrication method and structure
TAIWAN SEMICONDUCTOR MFG6 citations72