Inventor

LI JING HUI

CN5 patents

⚠️ This page may combine multiple inventors who share the name “LI JING HUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES SG PTE LTD

3 patents

US8358007B2Jan 22, 2013

Integrated circuit system employing low-k dielectrics and method of manufacture thereof

GLOBALFOUNDRIES SG PTE LTD18 citations82

US8053361B2Nov 8, 2011

Interconnects with improved TDDB

GLOBALFOUNDRIES SG PTE LTD3 citations59

US7906426B2Mar 15, 2011

Method of controlled low-k via etch for Cu interconnections

GLOBALFOUNDRIES SG PTE LTD0 citations45

SAMSUNG ELECTRONICS CO LTD

1 patent

US7687381B2Mar 30, 2010

Method of forming electrical interconnects within insulating layers that form consecutive sidewalls including forming a reaction layer on the inner sidewall

SAMSUNG ELECTRONICS CO LTD4 citations60

LI JING HUI

1 patent

US9281278B2Mar 8, 2016

Interconnects with improved TDDB

LI JING HUI1 citations42