Inventor

CHEN LIANG-GUANG

TW74 patents

⚠️ This page may combine multiple inventors who share the name “CHEN LIANG-GUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN LIANG-GUANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Mechanisms for removing debris from polishing pad

Fin Field-Effect Transistor device and method of forming the same

Method for operating a polishing head and method for polishing a substrate

Oxidation and etching post metal gate CMP

Oxidation and etching post metal gate CMP

Interconnect structure for semiconductor devices

Platen assembly, chemical-mechanical polisher, and method for polishing substrate

Mechanism for forming metal gate structure

Post-CMP cleaning and apparatus

Methods and systems for chemical mechanical polish and clean

Fin field-effect transistor device and method of forming the same

Chemical mechanical polishing apparatus and method

Formation method of semiconductor device structure

Polishing head, and chemical-mechanical polishing system for polishing substrate

Methods of forming an abrasive slurry and methods for chemical- mechanical polishing

Methods of forming an abrasive slurry and methods for chemical-mechanical polishing

Chemical mechanical polishing apparatus and method

Chemical mechanical polishing apparatus including a multi-zone platen

Chemical mechanical planarization tool

Composition and method for polishing and integrated circuit

Chemical mechanical polishing apparatus and method

Metal heterojunction structure with capping metal layer

Post-CMP cleaning and apparatus

Semiconductor processing tool and methods of operation

Method for metal gate surface clean

Fin Field-Effect Transistor device and method of forming the same

Post-CMP cleaning and apparatus

Metal heterojunction structure with capping metal layer

Method for metal gate surface clean

Post-CMP cleaning and apparatus

Chemical mechanical polishing composition and method

CMP slurry and CMP method

Metal heterojunction structure with capping metal layer

Methods of forming an abrasive slurry and methods for chemical-mechanical polishing

Semiconductor device cleaning solution, method of use, and method of manufacture

Slurry composition and method for polishing and integrated circuit

Slurry composition, semiconductor structure and method for forming the same

Semiconductor device cleaning solution, method of use, and method of manufacture

Semiconductor devices formed using multiple planarization processes

Method for reducing metal plug corrosion and device

Semiconductor device cleaning solution, method of use, and method of manufacture

Method for reducing metal plug corrosion and device

Microwave and infrared heating units for wet chemicals

Chemical mechanical planarization tool

TAIWAN SEMICONDUCTOR MFG

Oxidation and etching post metal gate CMP

Method for pre-conditioning CMP polishing pad

Polisher for chemical mechanical planarization

Method for cleaning metal gate surface

TU CHE-HAO

Gate height loss improvement for a transistor

Planarization process for semiconductor device fabrication