Inventor
LAI CHEN-CHUNG
TW19 patents
Patents
19 patentsUS9349688B2May 24, 2016
Systems and methods to enhance passivation integrity
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US9076804B2Jul 7, 2015
Systems and methods to enhance passivation integrity
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US9412866B2Aug 9, 2016
BEOL selectivity stress film
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations82
US9070687B2Jun 30, 2015
Semiconductor device with self-protecting fuse
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US9761486B2Sep 12, 2017
Method of chip packaging
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations66
US10777480B2Sep 15, 2020
Systems and methods to enhance passivation integrity
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10515866B2Dec 24, 2019
Systems and methods to enhance passivation integrity
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10157810B2Dec 18, 2018
Systems and methods to enhance passivation integrity
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10014251B2Jul 3, 2018
Semiconductor device with self-protecting fuse and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9773716B2Sep 26, 2017
Systems and methods to enhance passivation integrity
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9299621B2Mar 29, 2016
Smart measurement techniques to enhance inline process control stability
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9299658B2Mar 29, 2016
Semiconductor device with self-protecting fuse and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9093528B2Jul 28, 2015
Stress compensation layer to improve device uniformity
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9093373B2Jul 28, 2015
Conductive diffusion barrier structure for ohmic contacts
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10204843B2Feb 12, 2019
Interconnect arrangement with stress-reducing structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9818666B2Nov 14, 2017
Interconnect arrangement with stress-reducing structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9472508B2Oct 18, 2016
Interconnect arrangement with stress-reducing structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9252047B2Feb 2, 2016
Interconnect arrangement with stress-reducing structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9406559B2Aug 2, 2016
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations40