Inventor
KWIETNIAK KEITH T
US8 patents
Patents
8 patentsUS6974531B2Dec 13, 2005
Method for electroplating on resistive substrates
IBM20 citations92
US7863189B2Jan 4, 2011
Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density
IBM32 citations90
US7101784B2Sep 5, 2006
Method to generate porous organic dielectric
IBM5 citations73
US6592747B2Jul 15, 2003
Method of controlling additives in copper plating baths
IBM7 citations72
US6331237B1Dec 18, 2001
Method of improving contact reliability for electroplating
IBM12 citations70
US6921978B2Jul 26, 2005
Method to generate porous organic dielectric
IBM4 citations62
US7678258B2Mar 16, 2010
Void-free damascene copper deposition process and means of monitoring thereof
IBM1 citations51
US7227265B2Jun 5, 2007
Electroplated copper interconnection structure, process for making and electroplating bath
IBM1 citations51