Inventor
LEONG KUM FOO
MY4 patents
Patents
4 patentsUS6828512B2Dec 7, 2004
Apparatus and methods for interconnecting components to via-in-pad interconnects
INTEL CORP14 citations73
US7701069B2Apr 20, 2010
Solder interface locking using unidirectional growth of an intermetallic compound
INTEL CORP6 citations60
US7692301B2Apr 6, 2010
Stitched micro-via to enhance adhesion and mechanical strength
INTEL CORP0 citations49
US7229913B2Jun 12, 2007
Stitched micro-via to enhance adhesion and mechanical strength
INTEL CORP0 citations49