Inventor
WADA NORIO
JP13 patents
⚠️ This page may combine multiple inventors who share the name “WADA NORIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
6 patentsUS9469093B2Oct 18, 2016
Bonding apparatus, bonding system and bonding method
TOKYO ELECTRON LTD2 citations57
US11482431B2Oct 25, 2022
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations49
US11894246B2Feb 6, 2024
Bonding apparatus and bonding method
TOKYO ELECTRON LTD0 citations48
US10964563B2Mar 30, 2021
Bonding apparatus and bonding method
TOKYO ELECTRON LTD0 citations48
US9165803B2Oct 20, 2015
Bonding method, bonding apparatus and bonding system
TOKYO ELECTRON LTD0 citations47
US9005385B2Apr 14, 2015
Bonding apparatus, bonding system and bonding method
TOKYO ELECTRON LTD0 citations36
SHINKO ELECTRIC IND CO
4 patentsUS5365107ANov 15, 1994
Semiconductor device having tab tape
SHINKO ELECTRIC IND CO74 citations95
US5384204AJan 24, 1995
Tape automated bonding in semiconductor technique
SHINKO ELECTRIC IND CO47 citations89
US5183711AFeb 2, 1993
Automatic bonding tape used in semiconductor device
SHINKO ELECTRIC IND CO16 citations73
US5087530AFeb 11, 1992
Automatic bonding tape used in semiconductor device
SHINKO ELECTRIC IND CO7 citations73