Inventor
RAMACHANDRAN RAVIKUMAR
US113 patents
⚠️ This page may combine multiple inventors who share the name “RAMACHANDRAN RAVIKUMAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
28 patentsUS9431399B1Aug 30, 2016
Method for forming merged contact for semiconductor device
IBM31 citations94
US9496362B1Nov 15, 2016
Contact first replacement metal gate
IBM20 citations93
US8928086B2Jan 6, 2015
Strained finFET with an electrically isolated channel
IBM19 citations93
US7838908B2Nov 23, 2010
Semiconductor device having dual metal gates and method of manufacture
IBM28 citations93
US7122437B2Oct 17, 2006
Deep trench capacitor with buried plate electrode and isolation collar
IBM23 citations93
US8928057B2Jan 6, 2015
Uniform finFET gate height
IBM20 citations92
US6569769B1May 27, 2003
Slurry-less chemical-mechanical polishing
IBM22 citations92
US5932493AAug 3, 1999
Method to minimize watermarks on silicon substrates
IBM47 citations92
US6274440B1Aug 14, 2001
Manufacturing of cavity fuses on gate conductor level
IBM39 citations91
US6630074B1Oct 7, 2003
Etching composition and use thereof
IBM22 citations90
US9431395B2Aug 30, 2016
Protection of semiconductor-oxide-containing gate dielectric during replacement gate formation
IBM7 citations84
US9231072B2Jan 5, 2016
Multi-composition gate dielectric field effect transistors
IBM10 citations84
US9190406B2Nov 17, 2015
Fin field effect transistors having heteroepitaxial channels
IBM7 citations84
US9190520B2Nov 17, 2015
Strained finFET with an electrically isolated channel
IBM15 citations84
US9082851B2Jul 14, 2015
FinFET having suppressed leakage current
IBM15 citations84
US8912607B2Dec 16, 2014
Replacement metal gate structures providing independent control on work function and gate leakage current
IBM11 citations84
US8829617B2Sep 9, 2014
Uniform finFET gate height
IBM9 citations84
US8815693B2Aug 26, 2014
FinFET device formation
IBM13 citations84
US7528027B1May 5, 2009
Structure and method for manufacturing device with ultra thin SOI at the tip of a V-shape channel
IBM12 citations84
US7498271B1Mar 3, 2009
Nitrogen based plasma process for metal gate MOS device
IBM10 citations84
US9224826B2Dec 29, 2015
Multiple thickness gate dielectrics for replacement gate field effect transistors
IBM6 citations83
US7691701B1Apr 6, 2010
Method of forming gate stack and structure thereof
IBM16 citations83
US7943457B2May 17, 2011
Dual metal and dual dielectric integration for metal high-k FETs
IBM13 citations82
US7485510B2Feb 3, 2009
Field effect device including inverted V shaped channel region and method for fabrication thereof
IBM15 citations82
US6723611B2Apr 20, 2004
Vertical hard mask
IBM18 citations82
US12328859B2Jun 10, 2025
Stacked FET SRAM
IBM2 citations75
US6933192B1Aug 23, 2005
Method for fabricating a trench having a buried dielectric collar
IBM9 citations74
US6908806B2Jun 21, 2005
Gate metal recess for oxidation protection and parasitic capacitance reduction
IBM10 citations74
INFINEON TECHNOLOGIES AG
8 patentsUS7122439B2Oct 17, 2006
Method of fabricating a bottle trench and a bottle trench capacitor
INFINEON TECHNOLOGIES AG26 citations92
US6858441B2Feb 22, 2005
MRAM MTJ stack to conductive line alignment method
INFINEON TECHNOLOGIES AG37 citations92
US6358855B1Mar 19, 2002
Clean method for recessed conductive barriers
INFINEON TECHNOLOGIES AG24 citations92
US6443811B1Sep 3, 2002
Ceria slurry solution for improved defect control of silicon dioxide chemical-mechanical polishing
INFINEON TECHNOLOGIES AG40 citations91
US6579766B1Jun 17, 2003
Dual gate oxide process without critical resist and without N2 implant
INFINEON TECHNOLOGIES AG16 citations83
US6303506B1Oct 16, 2001
Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP process
INFINEON TECHNOLOGIES AG16 citations83
US6716734B2Apr 6, 2004
Low temperature sidewall oxidation of W/WN/poly-gatestack
INFINEON TECHNOLOGIES AG7 citations74
US6350692B1Feb 26, 2002
Increased polish removal rate of dielectric layers using fixed abrasive pads
INFINEON TECHNOLOGIES AG8 citations74
SIEMENS AG
5 patentsUS5807439ASep 15, 1998
Apparatus and method for improved washing and drying of semiconductor wafers
SIEMENS AG105 citations98
US5934299AAug 10, 1999
Apparatus and method for improved washing and drying of semiconductor wafers
SIEMENS AG30 citations93
US5980770ANov 9, 1999
Removal of post-RIE polymer on Al/Cu metal line
SIEMENS AG45 citations91
US6149830ANov 21, 2000
Composition and method for reducing dishing in patterned metal during CMP process
SIEMENS AG26 citations89
US6074935AJun 13, 2000
Method of reducing the formation of watermarks on semiconductor wafers
SIEMENS AG14 citations74
RAMACHANDRAN RAVIKUMAR
2 patentsKWON UNOH
2 patentsGLOBALFOUNDRIES INC
2 patentsUTOMO HENRY K
2 patentsINFINEON TECHNOLOGIES CORP
1 patentShowing the top 50 of 113 patents by PatentIndex Score.