Inventor
LEVESQUE JR DANIEL WAYNE
US6 patents
Patents
6 patentsUS10134657B2Nov 20, 2018
Inorganic wafer having through-holes attached to semiconductor wafer
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US10424606B1Sep 24, 2019
Systems and methods for reducing substrate surface disruption during via formation
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US10077206B2Sep 18, 2018
Methods of etching glass substrates and glass substrates
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US10366904B2Jul 30, 2019
Articles having holes with morphology attributes and methods for fabricating the same
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US11608291B2Mar 21, 2023
Micro-perforated panel systems, applications, and methods of making micro-perforated panel systems
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US10756003B2Aug 25, 2020
Inorganic wafer having through-holes attached to semiconductor wafer
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