Inventor
YANG CHIH-JEN
TW32 patents
⚠️ This page may combine multiple inventors who share the name “YANG CHIH-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
8 patentsUS7307380B2Dec 11, 2007
Cathode structure for inverted organic light emitting devices
IND TECH RES INST4 citations63
US9321654B2Apr 26, 2016
Organic dispersion of inorganic nano-platelets
IND TECH RES INST0 citations52
US10392493B2Aug 27, 2019
Dispersion solution, organic/inorganic hybrid material and preparation method thereof
IND TECH RES INST0 citations51
US10310179B1Jun 4, 2019
Optical waveguide and method for manufacturing the same
IND TECH RES INST0 citations51
US11106134B2Aug 31, 2021
Photosensitive composite material and method for forming composite film using the same
IND TECH RES INST0 citations50
US9771494B2Sep 26, 2017
Coating, method for manufacturing the coating and film formed by the coating
IND TECH RES INST1 citations50
US9513903B2Dec 6, 2016
Fault-tolerant system and fault-tolerant operating method capable of synthesizing result by at least two calculation modules
IND TECH RES INST0 citations39
US10268547B2Apr 23, 2019
Memory protection device and method
IND TECH RES INST0 citations36
APPLE INC
4 patentsUS9614183B2Apr 4, 2017
Organic light-emitting diode displays with crack detection and crack propagation prevention circuitry
APPLE INC22 citations92
US10707282B1Jul 7, 2020
Organic light-emitting diode display panels
APPLE INC13 citations85
US9818976B2Nov 14, 2017
Encapsulation layers with improved reliability
APPLE INC9 citations80
US11171313B2Nov 9, 2021
Incoherent thin film encapsulation for display
APPLE INC0 citations59
SILICONWARE PRECISION INDUSTRIES CO LTD
4 patentsUS6979886B2Dec 27, 2005
Short-prevented lead frame and method for fabricating semiconductor package with the same
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations71
US6809408B2Oct 26, 2004
Semiconductor package with die pad having recessed portion
SILICONWARE PRECISION INDUSTRIES CO LTD10 citations63
US7410835B2Aug 12, 2008
Method for fabricating semiconductor package with short-prevented lead frame
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations61
US10354891B2Jul 16, 2019
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41
AU OPTRONICS CORP
3 patentsTSMC SOLAR LTD
3 patentsUS9929304B2Mar 27, 2018
Method and system for forming absorber layer on metal coated glass for photovoltaic devices
TSMC SOLAR LTD0 citations51
US9103032B2Aug 11, 2015
Apparatus and method for forming thin films in solar cells
TSMC SOLAR LTD1 citations51
US9029737B2May 12, 2015
Method and system for forming absorber layer on metal coated glass for photovoltaic devices
TSMC SOLAR LTD0 citations51