Inventor

OU YING-TE

TW17 patents

⚠️ This page may combine multiple inventors who share the name “OU YING-TE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OU YING-TE

ADVANCED SEMICONDUCTOR ENG

Through silicon vias for semiconductor devices and manufacturing method thereof

Package structure for connection with output/input module

Semiconductor die, semiconductor wafer and method for manufacturing the same

Power and ground design for through-silicon via structure

Semiconductor device with conductive vias

Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via

Fabrication method of embedded chip substrate

Through silicon vias for semiconductor devices and manufacturing method thereof

Semiconductor package structures and methods of manufacturing the same

Semiconductor package structure and method of manufacturing the same

CHIU CHI TSUNG

EMI-shielded semiconductor devices and methods of making

HSU CHIH-JING

Semiconductor device and method for manufacturing the same

WANG YUNG-HUI

Fabrication method of embedded chip substrate

CHEN KUO-HUA

Package structure with embedded die and method of fabricating the same

WANG YUNG HUI

Method for manufacturing a circuit board having an embedded component therein

OU YING-TE

Semiconductor package structure and package method thereof

CHIU CHI-TSUNG

Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via