Inventor
KIM SUN-DONG
KR26 patents
⚠️ This page may combine multiple inventors who share the name “KIM SUN-DONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOREA ENERGY RESEARCH INST
9 patentsUS9761379B2Sep 12, 2017
Stack-type flow energy storage system and method of charging and discharging energy using the same
KOREA ENERGY RESEARCH INST2 citations68
US9806360B2Oct 31, 2017
Unit cell for solid-oxide fuel cell and solid-oxide fuel cell using same
KOREA ENERGY RESEARCH INST1 citations51
US9741497B2Aug 22, 2017
Beta-alumina and alpha-alumina bonding method using alpha-alumina and calcium oxide and thermal to electric converter using the same
KOREA ENERGY RESEARCH INST0 citations50
US9666377B2May 30, 2017
Internal current collection structure of thermal to electric converting cell and manufacturing method of the same
KOREA ENERGY RESEARCH INST0 citations50
US9607774B2Mar 28, 2017
AMTEC unit cell with partially opened internal electrode and method for manufacturing the AMTEC cell
KOREA ENERGY RESEARCH INST0 citations50
US9324506B2Apr 26, 2016
AMTEC cell and method for manufacturing the AMTEC cell
KOREA ENERGY RESEARCH INST0 citations40
US9312533B2Apr 12, 2016
Manufacturing methods of materials powder for performance improved electrode and using the same electrode and its application
KOREA ENERGY RESEARCH INST0 citations40
US9269971B2Feb 23, 2016
Flat-tubular solid oxide cell stack
KOREA ENERGY RESEARCH INST0 citations40
US9156741B2Oct 13, 2015
Carbon fiber-reinforced silicon carbide composite material and method of preparing the same
KOREA ENERGY RESEARCH INST0 citations38
LG SEMICON CO LTD
5 patentsUS5898212AApr 27, 1999
Lead frame and semiconductor package
LG SEMICON CO LTD23 citations92
US5877561AMar 2, 1999
Plate and column type semiconductor package having heat sink
LG SEMICON CO LTD21 citations92
US5963796AOct 5, 1999
Fabrication method for semiconductor package substrate and semiconductor package
LG SEMICON CO LTD14 citations73
US6002170ADec 14, 1999
Chip carrier with embedded leads and chip package using same
LG SEMICON CO LTD15 citations70
US6093959AJul 25, 2000
Lead frame having supporters and semiconductor package using same
LG SEMICON CO LTD6 citations61
HYUNDAI ELECTRONICS IND
3 patentsUS6344683B1Feb 5, 2002
Stacked semiconductor package with flexible tape
HYUNDAI ELECTRONICS IND54 citations96
US6627480B2Sep 30, 2003
Stacked semiconductor package and fabricating method thereof
HYUNDAI ELECTRONICS IND21 citations92
US6181560B1Jan 30, 2001
Semiconductor package substrate and semiconductor package
HYUNDAI ELECTRONICS IND17 citations92
KIM SUN-DONG
3 patentsUS8999594B2Apr 7, 2015
Unit cell for flat-tubular solid oxide fuel cell or solid oxide electrolyzer, and flat-tubular solid oxide fuel cell and flat-tubular solid oxide electrolyzer using the same
KIM SUN-DONG0 citations47
US8932779B2Jan 13, 2015
Device for solid oxide fuel cell or solid oxide electrolysis cell comprising integral one-piece current collector and manifold
KIM SUN-DONG0 citations36
US8927172B2Jan 6, 2015
Flat-tubular solid oxide cell stack
KIM SUN-DONG0 citations34