Inventor

LIU JEN-CHENG

TW379 patents

⚠️ This page may combine multiple inventors who share the name “LIU JEN-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU JEN-CHENG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device structure with a conductive feature passing through a passivation layer

Structure for standard logic performance improvement having a back-side through-substrate-via

Structure for stacked logic performance improvement

Mechanisms for forming image-sensor device with deep-trench isolation structure

Mechanisms for forming image-sensor device with deep-trench isolation structure

Pixel structure of image sensor and method of forming same

Interconnect structure and method of forming same

3DIC interconnect apparatus and method

Structure for standard logic performance improvement having a back-side through-substrate-via

Through silicon via design for stacking integrated circuits

Through silicon via design for stacking integrated circuits

Hybrid bonding technology for stacking integrated circuits

Mechanisms for forming image-sensor device with deep-trench isolation structure

Through silicon via design for stacking integrated circuits

Image sensing device

Back side illuminated image sensor with reduced sidewall-induced leakage

Integrated circuit (IC) structure for high performance and functional density

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Back-side deep trench isolation (BDTI) structure for pinned photodiode image sensor

Mechanisms for forming image sensor device with deep-trench isolation structure

3DIC interconnect apparatus and method

3DIC seal ring structure and methods of forming same

TAIWAN SEMICONDUCTOR MFG

Method and apparatus for image sensor packaging

Methods for hybrid wafer bonding

Fully dry post-via-etch cleaning method for a damascene process

Dual damascene process for carbon-based low-K materials

Dual damascene approach for small geometry dimension

Vertically integrated image sensor chips and methods for forming the same

Seal ring structure with a metal pad

Backside structure for a BSI image sensor device

Alignment for backside illumination sensor

Method for preventing photoresist poisoning

Elevated photodiode with a stacked scheme

Dual damascene process to reduce etch barrier thickness

Method for improving faceting effect in dual damascene process

PE-SiN spacer profile for C2 SAC isolation window

Multiple seal ring structure

Process for improving copper fill integrity

Method to fabricate self-aligned dual damascene structures

Film stack and etching sequence for dual damascene

WANG WEN-DE

Pad design for backside illuminated image sensor

Front side implanted guard ring structure for backside illuminated image sensor

CHEN SZU-YING

Apparatus and method for improving charge transfer in backside illuminated image sensor

Image sensor with deep trench isolation structure

WANG TZU-JUI

Apparatus for vertically integrated backside illuminated image sensors

Image sensor with anti-reflection layer and method of manufacturing the same

LIU JEN-CHENG

Bonding process for CMOS image sensor

WAN MENG-HSUN

CMOS image sensor chips with stacked scheme and methods for forming the same

CHUANG CHUN-CHIEH

Backside structure and methods for BSI image sensors

WAN MENG HSUN

CMOS image sensor chips with stacked scheme and methods for forming the same