Inventor

CHOU SHIH PEI

TW85 patents

⚠️ This page may combine multiple inventors who share the name “CHOU SHIH PEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOU SHIH PEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Conductive pad structure for hybrid bonding and methods of forming same

Method of forming absorption enhancement structure for image sensor

Isolation structure for bond pad structure

Isolation structure for bond pad structure

Method for forming a semiconductor-on-insulator (SOI) substrate

Method for forming a thin semiconductor-on-insulator (SOI) substrate

Absorption enhancement structure for image sensor

Bond pad structure for bonding improvement

Deep trench isolations and methods of forming the same

Deep trench isolation fabrication for BSI image sensor

Deep trench isolation shrinkage method for enhanced device performance

Interconnect structure for connecting dies and methods of forming the same

Interconnect apparatus and method

3DIC interconnect apparatus and method

3DIC structure and method for hybrid bonding semiconductor wafers

Bond pad structure with reduced step height and increased electrical isolation

Method for forming thin semiconductor-on-insulator (SOI) substrates

Method for forming a semiconductor-on-insulator (SOI) substrate

Dummy vertical transistor structure to reduce cross talk in pixel sensor

Bond pad structure for bonding improvement

Bond pad structure with reduced step height and increased electrical isolation

Self aligned grids in BSI image sensor

Absorption enhancement structure for image sensor

Method for forming thin semiconductor-on-insulator (SOI) substrates

Absorption enhancement structure for image sensor

Deep trench isolation shrinkage method for enhanced device performance

Front side illuminated image sensor device structure and method for forming the same

Semiconductor structure and manufacturing method thereof

Interconnect structure for stacked device

Varied STI liners for isolation structures in image sensing devices

Image sensor device structure

Conductive pad structure for hybrid bonding and methods of forming same

Method for forming alignment marks and structure of same

Stacked image sensor having a barrier layer

Method for forming a semiconductor-on-insulator (SOI) substrate

Method for forming a semiconductor-on-insulator (SOI) substrate

Method for forming thin semiconductor-on-insulator (SOI) substrates

Semiconductor structure and manufacturing method thereof

3DIC interconnect apparatus and method

Method for forming alignment marks and structure of same

Semiconductor structure having a silicon active layer formed over a SiGe etch stop layer and an insulating layer with a through silicon via (TSV) passed therethrough

Isolation structure for bond pad structure

Method for forming light pipe structure with high quantum efficiency

Isolation structure for bond pad structure

Self aligned grids in BSI image sensor

TAIWAN SEMICONDUCTOR MFG

Varied STI liners for isolation structures in image sensing devices

3DIC interconnect apparatus and method

Method for forming alignment marks and structure of same

CHOU SHIH PEI

Formation of embedded micro-lens

HO CHENG-YING

CMOS image sensor and method for forming the same