Inventor
PARK BYUNGLYUL
KR7 patents
Patents
7 patentsUS6709970B1Mar 23, 2004
Method for creating a damascene interconnect using a two-step electroplating process
SAMSUNG ELECTRONICS CO LTD43 citations86
US9806004B2Oct 31, 2017
Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping pad
SAMSUNG ELECTRONICS CO LTD8 citations82
US9799619B2Oct 24, 2017
Electronic device having a redistribution area
SAMSUNG ELECTRONICS CO LTD9 citations82
US11121090B2Sep 14, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations68
USD859390SSep 10, 2019
Cover for an electronic device
SAMSUNG ELECTRONICS CO LTD4 citations65
US11694965B2Jul 4, 2023
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations58
US10020273B2Jul 10, 2018
Semiconductor devices and methods of forming the same
SAMSUNG ELECTRONICS CO LTD1 citations50