Inventor
AN JINHO
KR6 patents
Patents
6 patentsUS9806004B2Oct 31, 2017
Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping pad
SAMSUNG ELECTRONICS CO LTD8 citations82
US9799619B2Oct 24, 2017
Electronic device having a redistribution area
SAMSUNG ELECTRONICS CO LTD9 citations82
US11476176B2Oct 18, 2022
Semiconductor device having via protective layer
SAMSUNG ELECTRONICS CO LTD2 citations70
US11978688B2May 7, 2024
Semiconductor device having via protective layer
SAMSUNG ELECTRONICS CO LTD0 citations60
US12142541B2Nov 12, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US12021034B2Jun 25, 2024
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49