Inventor

NIKITIN IVAN

DE65 patents

⚠️ This page may combine multiple inventors who share the name “NIKITIN IVAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NIKITIN IVAN

INFINEON TECHNOLOGIES AG

Method for forming electronic components

Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material

Package with interconnections having different melting temperatures

Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device

Semiconductor device

Power module comprising two substrates and method of manufacturing the same

Power module with press-fit contacts

Semiconductor package with multi-level conductive clip for top side cooling

Molded semiconductor module having a mold step for increasing creepage distance

Semiconductor device

Spacer frame for semiconductor packages

Electronic module and method of manufacturing the same

Method for fabricating a module including a sintered joint

Fluid-cooled package having shielding layer

Package cooled with cooling fluid and comprising shielding layer

Package with partially encapsulated cooling channel for cooling an encapsulated chip

Solder stop feature for electronic devices

Package with roughened encapsulated surface for promoting adhesion

Power semiconductor module

Electronic devices including electrically insulated load electrodes

Molded semiconductor module for PCB embedding

Integrated circuit and method of manufacturing an integrated circuit

Semiconductor device having peripheral polymer structures

Method of manufacturing a semiconductor device

Power semiconductor module and method for producing a power semiconductor module

NIKITIN IVAN

Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device

Semiconductor package and methods of formation thereof

Electronic device and a method for fabricating an electronic device

Method of manufacturing an electronic system

Semiconductor device and method of manufacturing thereof

Semiconductor device and method

Semiconductor device including spacer element

Semiconductor device including a sintered insulation material

Method of manufacturing an electronic system

Semiconductor device

INFINEON TECHNOLOGIES AUSTRIA AG

Electronic power device and method of fabricating an electronic power device

Additive manufacturing of a frontside or backside interconnect of a semiconductor die

Power module with metal substrate

Power module with metal substrate

Stacked module arrangement

Semiconductor package comprising a cavity with exposed contacts and a semiconductor module

INFINEON TECHNOLOGIES AUSTRIA

Multichip device

Encapsulated semiconductor device

GUTH KARSTEN

Module including a sintered joint bonding a semiconductor chip to a copper surface

Module including a sintered joint bonding a semiconductor chip to a copper surface

EWE HENRIK

Laminate electronic device

HENRIK EWE

Laminate electronic device

HOSSEINI KHALIL

Electronic device and method of fabricating an electronic device

MAHLER JOACHIM

Integrated circuits and a method for manufacturing an integrated circuit

FRANK MANFRED

Semiconductor device and method for making same