Inventor
PILZ HEINZ
DE4 patents
Patents
4 patentsUS6057178AMay 2, 2000
Method of padding an electronic component, mounted on a flat substrate, with a liquid filler
SIEMENS AG54 citations92
US6653743B2Nov 25, 2003
Electronic component mounted on a flat substrate and padded with a fluid filler
SIEMENS AG8 citations70
US10105758B2Oct 23, 2018
Arrangement for coating a powder
SIEMENS AG3 citations66
US6445074B1Sep 3, 2002
Electronic component mounted on a flat substrate and padded with a fluid filler
SIEMENS AG3 citations59