Inventor
AIZAWA HIROKAZU
US9 patents
⚠️ This page may combine multiple inventors who share the name “AIZAWA HIROKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
7 patentsUS10777456B1Sep 15, 2020
Semiconductor back end of line (BEOL) interconnect using multiple materials in a fully self-aligned via (FSAV) process
TOKYO ELECTRON LTD6 citations71
US10734278B2Aug 4, 2020
Method of protecting low-K layers
TOKYO ELECTRON LTD3 citations68
US12417925B2Sep 16, 2025
Method of conductive material deposition
TOKYO ELECTRON LTD0 citations62
US11315789B2Apr 26, 2022
Method and structure for low density silicon oxide for fusion bonding and debonding
TOKYO ELECTRON LTD0 citations58
US12550696B2Feb 10, 2026
Patterning with self-assembled monolayer
TOKYO ELECTRON LTD0 citations51
US11380579B2Jul 5, 2022
Method and process using dual memorization layer for multi-color spacer patterning
TOKYO ELECTRON LTD0 citations51
US12438006B2Oct 7, 2025
Metal hard mask integration
TOKYO ELECTRON LTD0 citations50