Inventor
ZBINDEN ERIC J
US27 patents
⚠️ This page may combine multiple inventors who share the name “ZBINDEN ERIC J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMTEC INC
22 patentsUS10114182B2Oct 30, 2018
Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
SAMTEC INC57 citations97
US11372178B2Jun 28, 2022
Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
SAMTEC INC8 citations94
US10534145B2Jan 14, 2020
Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
SAMTEC INC15 citations94
US11177614B2Nov 16, 2021
Transceiver assembly array with fixed heatsink and floating transceivers
SAMTEC INC23 citations92
US11536918B2Dec 27, 2022
Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
SAMTEC INC6 citations85
US11650383B2May 16, 2023
Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
SAMTEC INC3 citations84
US11536917B2Dec 27, 2022
Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
SAMTEC INC4 citations84
US11500168B2Nov 15, 2022
Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
SAMTEC INC3 citations84
US11500167B2Nov 15, 2022
Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
SAMTEC INC3 citations84
US10436992B2Oct 8, 2019
Transceiver and interface for IC package
SAMTEC INC7 citations83
US9915797B2Mar 13, 2018
Transceiver and interface for IC package
SAMTEC INC6 citations83
US9915796B2Mar 13, 2018
Transceiver and interface for IC package
SAMTEC INC3 citations83
US9835811B2Dec 5, 2017
Transceiver and interface for IC package
SAMTEC INC5 citations83
US11828908B2Nov 28, 2023
Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
SAMTEC INC1 citations73
US12140809B2Nov 12, 2024
Transceiver and interface for IC package
SAMTEC INC0 citations62
US11621523B2Apr 4, 2023
Transceiver assembly array with fixed heatsink and floating transceivers
SAMTEC INC0 citations61
US10164708B1Dec 25, 2018
Methods for determining receiver coupling efficiency, link margin, and link topology in active optical cables
SAMTEC INC1 citations61
US12278441B2Apr 15, 2025
Ultra-dense, low-profile edge card connector
SAMTEC INC0 citations59
US12244084B2Mar 4, 2025
Interconnection system, case assembly, electrical connector, assembly and connector assembly using detachable, cabled front-panel connector
SAMTEC INC0 citations56
US10001609B2Jun 19, 2018
Connector assembly
SAMTEC INC0 citations52
US10116386B2Oct 30, 2018
Methods for determining receiver coupling efficiency, link margin, and link topology in active optical cables
SAMTEC INC0 citations50
US9819413B2Nov 14, 2017
Methods for determining receiver coupling efficiency, link margin, and link topology in active optical cables
SAMTEC INC0 citations50
INTEL CORP
5 patentsUS7176436B2Feb 13, 2007
Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header
INTEL CORP11 citations84
US6905354B1Jun 14, 2005
U-clip for optical device alignment
INTEL CORP12 citations84
US6747820B2Jun 8, 2004
Cooling opto-electronic packages
INTEL CORP7 citations70
US6947229B2Sep 20, 2005
Etalon positioning using solder balls
INTEL CORP2 citations57
US6846117B2Jan 25, 2005
Optical module package
INTEL CORP0 citations52