Inventor

MCCALL JAMES A

US81 patents

⚠️ This page may combine multiple inventors who share the name “MCCALL JAMES A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MCCALL JAMES A

INTEL CORP

Buffering data transfer between a chipset and memory modules

Systems having modules with on die terminations

Differential memory interface system

Termination cards and systems therefore

Multi-layer printed circuit board with signal traces of varying width

Multiple rank high bandwidth memory

Stacking integrated circuit dies

Buffered continuous multi-drop clock ring

Impedance compensation for circuit board breakout region

Techniques to access or operate a dual in-line memory module via multiple data channels

Dynamic bus inversion with programmable termination level to maintain programmable target ratio of ones and zeros in signal lines

Dynamic bus inversion with programmable termination level to maintain programmable target ratio of ones and zeros in signal lines

Periodic training for unmatched signal receiver

Method of manufacturing a circuit board

Initiation of differential link retraining upon temperature excursion

Modules having paths of different impedances

Memory system and method to reduce reflection and signal degradation

Circulator chain memory command and address bus topology

Systems having modules with selectable on die terminations

Split delay transmission line

Computer assembly with stub traces coupled to vias to add capacitance at the vias

Memory module using DRAM package to match channel impedance

Systems with skew control between clock and data signals

Memory module with parallel stub traces

Techniques to couple high bandwidth memory device on silicon substrate and package substrate

DIMM for a high bandwidth memory channel

Techniques to access or operate a dual in-line memory module via multiple data channels

Dynamic bus inversion with programmable termination level to maintain programmable target ratio of ones and zeros in signal lines

Impedance compensation based on detecting sensor data

Reconfigurable clocking architecture

Method and apparatus for dynamic memory termination

Apparatus, method and system for determining reference voltages for a memory

Circuit board design

Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards

Countering power resonance

Systems having modules with buffer chips

Systems having modules sharing on module terminations

Applying chip select for memory device identification and power management control

DDR memory bus with a reduced data strobe signal preamble timespan

High bandwidth DIMM

Method and apparatus for dynamic memory termination

Single-ended memory interface system

Systems with modules sharing terminations

Systems with modules and clocking therefore

Capacitively loaded continuity module

MCCALL JAMES A

Methods and apparatuses for dynamic memory termination

Method and apparatus for dynamic memory termination

Method of manufacturing a circuit board

BAINS KULJIT S

Method, apparatus and system for exchanging communications via a command/address bus

TAHOE RES LTD

Techniques to couple high bandwidth memory device on silicon substrate and package substrate