Inventor
MALONE KELLY
US30 patents
⚠️ This page may combine multiple inventors who share the name “MALONE KELLY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
26 patentsUS7057287B2Jun 6, 2006
Dual damascene integration of ultra low dielectric constant porous materials
IBM34 citations92
US7084479B2Aug 1, 2006
Line level air gaps
IBM27 citations90
US7711462B2May 4, 2010
Vehicle help system and method
IBM34 citations89
US10333927B2Jun 25, 2019
Simulated SSO functionality by means of multiple authentication procedures and out-of-band communications
IBM8 citations84
US10305882B2May 28, 2019
Using a service-provider password to simulate F-SSO functionality
IBM7 citations84
US9807087B2Oct 31, 2017
Using an out-of-band password to provide enhanced SSO functionality
IBM9 citations84
US7816253B2Oct 19, 2010
Surface treatment of inter-layer dielectric
IBM10 citations84
US7338895B2Mar 4, 2008
Method for dual damascene integration of ultra low dielectric constant porous materials
IBM9 citations84
US6831363B2Dec 14, 2004
Structure and method for reducing thermo-mechanical stress in stacked vias
IBM18 citations83
US6783862B2Aug 31, 2004
Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures
IBM12 citations82
US10144275B2Dec 4, 2018
Environmental control in vehicles
IBM9 citations79
US8037095B2Oct 11, 2011
Dynamic webcast content viewer method and system
IBM11 citations75
US7737561B2Jun 15, 2010
Dual damascene integration of ultra low dielectric constant porous materials
IBM5 citations74
US7671470B2Mar 2, 2010
Enhanced mechanical strength via contacts
IBM5 citations74
US7439624B2Oct 21, 2008
Enhanced mechanical strength via contacts
IBM6 citations74
US7187081B2Mar 6, 2007
Polycarbosilane buried etch stops in interconnect structures
IBM7 citations74
US10063539B2Aug 28, 2018
SSO functionality by means of a temporary password and out-of-band communications
IBM2 citations73
US7670943B2Mar 2, 2010
Enhanced mechanical strength via contacts
IBM2 citations63
US7396758B2Jul 8, 2008
Polycarbosilane buried etch stops in interconnect structures
IBM4 citations63
US6764873B2Jul 20, 2004
Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same
IBM4 citations62
US7933592B2Apr 26, 2011
Cellular telephone signal monitoring method and system
IBM3 citations60
US9170296B2Oct 27, 2015
Semiconductor device defect monitoring using a plurality of temperature sensing devices in an adjacent semiconductor device
IBM3 citations58
US8735284B2May 27, 2014
Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates
IBM0 citations52
US7879717B2Feb 1, 2011
Polycarbosilane buried etch stops in interconnect structures
IBM0 citations52
US10410497B1Sep 10, 2019
Anonymous notification and intervention of users requiring assistance
IBM0 citations43
US8032834B2Oct 4, 2011
Context-based user assistance
IBM0 citations39