Inventor
LIN SHIH-JANG
TW4 patents
Patents
4 patentsUS6426281B1Jul 30, 2002
Method to form bump in bumping technology
TAIWAN SEMICONDUCTOR MFG147 citations98
US6586323B1Jul 1, 2003
Method for dual-layer polyimide processing on bumping technology
TAIWAN SEMICONDUCTOR MFG76 citations97
US6936923B2Aug 30, 2005
Method to form very a fine pitch solder bump using methods of electroplating
TAIWAN SEMICONDUCTOR MFG23 citations92
US6958546B2Oct 25, 2005
Method for dual-layer polyimide processing on bumping technology
TAIWAN SEMICONDUCTOR MFG45 citations90