Inventor

LIN CHARLES W C

SG187 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHARLES W C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHARLES W C

BRIDGE SEMICONDUCTOR CORP

Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture

Semiconductor chip assembly with embedded metal particle

Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal

Semiconductor chip assembly with bumped terminal, filler and insulative base

Semiconductor chip assembly with welded metal pillar of stacked metal balls

Semiconductor chip assembly with laterally aligned bumped terminal and filler

Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond

Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture

Semiconductor chip assembly with welded metal pillar

Semiconductor chip assembly with bumped conductive trace

Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly

Three-dimensional stacked semiconductor package with pillars in pillar cavities

Semiconductor chip assembly with embedded metal pillar

Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing

Method of making a semiconductor chip assembly with chip and encapsulant grinding

Semiconductor chip assembly with post/base heat spreader and vertical signal routing

Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding

Semiconductor chip assembly with precision-formed metal pillar

Method of connecting a conductive trace to a semiconductor chip using conductive adhesive

Semiconductor chip assembly with solder-attached ground plane

Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection joint

Semiconductor chip assembly with carved bumped terminal

Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture

Semiconductor chip assembly with bumped metal pillar

Semiconductor chip assembly with interlocked contact terminal

Method of making a semiconductor chip assembly with a pillar and a routing line using multiple etch steps

Method of making a semiconductor chip assembly with an embedded metal particle

Semiconductor chip assembly with chip in substrate cavity

Method of making a semiconductor chip assembly with a conductive trace and a substrate

Method of connecting a conductive trace and an insulative base to a semiconductor chip

Semiconductor chip assembly with bumped conductive trace

(unassigned)

Three-dimensional stacked semiconductor package

Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit

Three-dimensional stacked semiconductor package

Three-dimensional stacked semiconductor package

Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly

Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint

Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint

Support circuit with a tapered through-hole for a semiconductor chip assembly

Semiconductor chip assembly with interlocked conductive trace

Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint

Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint

Method of connecting a conductive trace to a semiconductor chip

Method of connecting a conductive trace to a semiconductor chip

MICROELECTRONICS & COMPUTER

Selective electroless plating process for metal conductors

Multilayer electrical interconnect fabrication with few process steps

Method of patterning electroless plated metal on a polymer substrate

Method for producing conductive patterns

LIN CHARLES W C

Semiconductor chip assembly with post/base heat spreader with thermal via

MICROELECTRONCS AND COMPUTER T

Detecting completion of electroless via fill