Inventor
TJHIA EDDY
US9 patents
⚠️ This page may combine multiple inventors who share the name “TJHIA EDDY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONIX INC
3 patentsFAIRCHILD SEMICONDUCTOR
2 patentsUS7800219B2Sep 21, 2010
High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same
FAIRCHILD SEMICONDUCTOR10 citations82
US7960800B2Jun 14, 2011
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
FAIRCHILD SEMICONDUCTOR5 citations72
GRUENHAGEN MICHAEL D
2 patentsUS8058732B2Nov 15, 2011
Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same
GRUENHAGEN MICHAEL D10 citations81
US8598035B2Dec 3, 2013
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
GRUENHAGEN MICHAEL D3 citations60