Inventor

WANG CHIA-CHUNG

TW105 patents

⚠️ This page may combine multiple inventors who share the name “WANG CHIA-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG CHIA-CHUNG

BRIDGE SEMICONDUCTOR CORP

Semiconductor chip assembly with welded metal pillar of stacked metal balls

Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing

Semiconductor chip assembly with post/base heat spreader and vertical signal routing

Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding

Semiconductor chip assembly with precision-formed metal pillar

Semiconductor chip assembly with interlocked contact terminal

Semiconductor chip assembly with chip in substrate cavity

Method of making a semiconductor chip assembly with a conductive trace and a substrate

Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same

Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same

Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same

Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same

Semiconductor device with face-to-face chips on interposer and method of manufacturing the same

Semiconductor package with package-on-package stacking capability and method of manufacturing the same

Semiconductor package with package-on-package stacking capability and method of manufacturing the same

Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post

Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace

Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment

Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal

Semiconductor chip assembly with metal containment wall and solder terminal

Method of making a semiconductor chip assembly with a precision-formed metal pillar

Method of making a semiconductor chip assembly with an interlocked contact terminal

Stackable semiconductor package having metal pin within through hole of package

LIN CHARLES W C

Semiconductor chip assembly with post/base heat spreader with thermal via

Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby

Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump

Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace

Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer

Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump

Semiconductor chip assembly with ceramic/metal substrate

Semiconductor chip assembly with post/base heat spreader with ESD protection layer

Method of making a semiconductor chip assembly with a ceramic/metal substrate

Semiconductor chip assembly with post/base/post heat spreader

Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity

Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace

Method of making a semiconductor chip assembly with a post/base/post heat spreader

Semiconductor chip assembly with post/base heat spreader and ceramic block in post

Semiconductor chip assembly with post/base heat spreader, signal post and cavity

Semiconductor chip assembly with post/base heat spreader and cavity in post

Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via

Semiconductor chip assembly with post/base heat spreader and plated through-hole

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post

IND TECH RES INST

Stacked semiconductor package formed on a substrate and method for fabrication

Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips

SHELL OIL CO

Process of making ketones

WANG CHIA-CHUNG

Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing