Inventor · disambiguated record
Abdallah Bacha
Also filed as: BACHA ABDALLAH
6 granted patents·17 pending applications·40 citations·filing 2004–2023
80Inventor score
Top patents by PatentIndex Score
23 records- 0178US7375971B2Memory module with an electronic printed circuit board and a plurality of semiconductor chips of the same typeINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 20, 2008·9 cites·29 claims
- 0271US7869243B2Memory moduleQIMONDA AG·Filed 2008·Granted Jan 11, 2011·9 cites·20 claims
- 0369US8040710B2Semiconductor memory arrangementQIMONDA AG·Filed 2007·Granted Oct 18, 2011·5 cites·27 claims
- 0465US7334150B2Memory module with a clock signal regeneration circuit and a register circuit for temporarily storing the incoming command and address signalsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 19, 2008·14 cites·17 claims
- 0558US2025201761A1Self-aligning semiconductor constructionINTEL CORP·Filed 2023·Application pending·0 cites
- 0657US12476176B2Glass core substrate printed circuit board for warpage reductionINTEL CORP·Filed 2022·Granted Nov 18, 2025·0 cites·25 claims
- 0755US2025112202A1Thermal interface material on a surface of a die in a cavityINTEL CORP·Filed 2023·Application pending·0 cites
- 0855US2025112139A1Vias through a die that are electrically isolated from active circuitry in the dieINTEL CORP·Filed 2023·Application pending·0 cites
- 0953US2025112206A1Die placement within a formed cavity on a redistribution layerINTEL CORP·Filed 2023·Application pending·0 cites
- 1048US2023317705A1Thin client form factor assemblyINTEL CORP·Filed 2022·Application pending·0 cites
- 1148US2023317681A1Three-dimensional stack cooling wingsINTEL CORP·Filed 2022·Application pending·0 cites
- 1248US2023317620A1Interposers for semiconductor devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1348US2023317618A1Glass bridge for connecting diesINTEL CORP·Filed 2022·Application pending·0 cites
- 1448US2023317551A1Heterogeneous packages having thermal towersINTEL CORP·Filed 2022·Application pending·0 cites
- 1546US2023282615A1Stacked die packaging architecture with conductive vias on interposerINTEL CORP·Filed 2022·Application pending·0 cites
- 1644US6894525B2Method and device for time measurement on semiconductor modules employing the ball-grid-array techniqueINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 17, 2005·3 cites·17 claims
- 1744US2023299014A1Microelectronic assemblies including stiffenersINTEL CORP·Filed 2022·Application pending·0 cites
- 1844US2023299013A1Microelectronic assemblies including stiffenersINTEL CORP·Filed 2022·Application pending·0 cites
- 1944US2023299012A1Microelectronic assemblies including stiffenersINTEL CORP·Filed 2022·Application pending·0 cites
- 2042US2007224854A1Memory module, method of manufacturing a memory module and computer systemBACHA ABDALLAH·Filed 2006·Application pending·0 cites
- 2141US2008225503A1Electronic system with integrated circuit device and passive componentQIMONDA AG·Filed 2007·Application pending·0 cites
- 2239US2004201405A1Topology for providing clock signals to multiple circuit units on a circuit moduleFiled 2004·Application pending·0 cites
- 2324US2007258278A1Memory module and methods for making and using the sameBACHA ABDALLAH·Filed 2006·Application pending·0 cites
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