Inventor · disambiguated record
Carl Alvin Dilao
Also filed as: DILAO CARL ALVIN
2 granted patents·1 pending application·2 citations·filing 2010–2012
38Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0151US8692394B2Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor deviceLEE YANGSOO·Filed 2010·Granted Apr 8, 2014·1 cites·20 claims
- 0248US9011629B2Adhesive for electronic components, and manufacturing method for semiconductor chip mountDILAO CARL ALVIN·Filed 2012·Granted Apr 21, 2015·1 cites·14 claims
- 0332US2012326301A1Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor deviceWAKIOKA SAYAKA·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →