Inventor
HSIAO SHENG-TSUNG
TW7 patents
Patents
7 patentsUS11996351B2May 28, 2024
Packaged semiconductor device including liquid-cooled lid and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD20 citations93
US11387164B2Jul 12, 2022
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations93
US11410910B2Aug 9, 2022
Packaged semiconductor device including liquid-cooled lid and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12341081B2Jun 24, 2025
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11955405B2Apr 9, 2024
Semiconductor package including thermal interface structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901263B2Feb 13, 2024
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11631629B2Apr 18, 2023
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62