Inventor

BOWER CHRISTOPHER

US125 patents

⚠️ This page may combine multiple inventors who share the name “BOWER CHRISTOPHER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BOWER CHRISTOPHER

X CELEPRINT LTD

Micro assembled LED displays and lighting elements

Micro-transfer-printed acoustic wave filter device

Systems and methods for controlling release of transferable semiconductor structures

Systems and methods for preparing GaN and related materials for micro assembly

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

Printable inorganic semiconductor structures

Systems and methods for controlling release of transferable semiconductor structures

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

Chiplets with connection posts

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

Inorganic-light-emitter display with integrated black matrix

Display tile structure and tiled display

Micro assembled hybrid displays and lighting elements

Inorganic light-emitting diode with encapsulating reflector

Micro-transfer printable electronic component

Devices with a single metal layer

Micro-transfer-printable flip-chip structures and methods

Micro-transfer-printed light-emitting diode device

Small-aperture-ratio display with electrical component

Multi-LED components

Structures and methods for testing printable integrated circuits

Redistribution layer for substrate contacts

Crystalline color-conversion device

Stamp with structured posts

Bit-plane pulse width modulated digital display system

Apparatus and methods for micro-transfer-printing

Display with color conversion

Methods for surface attachment of flipped active components

Display tile structure and tiled display

Methods for surface attachment of flipped active components

Apparatus and methods for micro-transfer-printing

BOWER CHRISTOPHER

Substrates with transferable chiplets

Methods for surface attachment of flipped active componenets

Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby

High-yield fabrication of large-format substrates with distributed, independent control elements

Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance

Structures and methods for testing printable integrated circuits

X DISPLAY COMPANY TECH LTD

Micro assembled LED displays and lighting elements

Printable component structure with electrical contact

SEMPRIUS INC

Substrates with transferable chiplets

Methods for surface attachment of flipped active components

GLOBAL OLED TECHNOLOGY LLC

OLED device with embedded chip driving

CELEPRINT LTD X

Apparatus and methods for micro-transfer-printing

MENARD ETIENNE

Electrically bonded arrays of transfer printed active components

MEITL MATTHEW

Methods of fabricating printable compound semiconductor devices on release layers