Inventor
FRUTSCHY KRISTOPHER J
US8 patents
Patents
8 patentsUS6535386B2Mar 18, 2003
Electronic assembly having a heat pipe that conducts heat from a semiconductor die
INTEL CORP78 citations94
US7131850B2Nov 7, 2006
Socket for a microelectronic component having reduced electrical resistance and inductance
INTEL CORP15 citations82
US7209026B2Apr 24, 2007
Integrated package inductor for integrated circuit devices
INTEL CORP11 citations79
US7187066B2Mar 6, 2007
Radiant energy heating for die attach
INTEL CORP6 citations71
US7064004B2Jun 20, 2006
Induction-based heating for chip attach
INTEL CORP10 citations71
US7585693B2Sep 8, 2009
Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method
INTEL CORP6 citations54
US6221459B1Apr 24, 2001
Controlling the heat expansion of electrical couplings
INTEL CORP1 citations51
US7691671B2Apr 6, 2010
Radiant energy heating for die attach
INTEL CORP0 citations50