Inventor

OIDA SEISHI

JP7 patents

⚠️ This page may combine multiple inventors who share the name “OIDA SEISHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

3 patents

US6291274B1Sep 18, 2001

Resin molded semiconductor device and method for manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD60 citations94

US6853077B2Feb 8, 2005

Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations64

US6917118B2Jul 12, 2005

Semiconductor device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations61

MATSUSHITA ELECTRONICS CORP

2 patents

US6258314B1Jul 10, 2001

Method for manufacturing resin-molded semiconductor device

MATSUSHITA ELECTRONICS CORP25 citations91

US6126885AOct 3, 2000

Method for manufacturing resin-molded semiconductor device

MATSUSHITA ELECTRONICS CORP20 citations91

OOMORI KOUJI

1 patent

US9018761B2Apr 28, 2015

Semiconductor device

OOMORI KOUJI1 citations46

OIDA SEISHI

1 patent

US8283759B2Oct 9, 2012

Lead frame having outer leads coated with a four layer plating

OIDA SEISHI0 citations36