P

Inventor

HETZEL WOLFGANG

DE11 patents
⚠️ This page may combine multiple inventors who share the name “HETZEL WOLFGANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

7 patents
US6894381B2May 17, 2005

Electronic device having a stack of semiconductor chips and method for the production thereof

INFINEON TECHNOLOGIES AG68 citations96
US6927484B2Aug 9, 2005

Stack arrangement of a memory module

INFINEON TECHNOLOGIES AG31 citations92
US7402911B2Jul 22, 2008

Multi-chip device and method for producing a multi-chip device

INFINEON TECHNOLOGIES AG19 citations83
US7198979B2Apr 3, 2007

Method for manufacturing a stack arrangement of a memory module

INFINEON TECHNOLOGIES AG10 citations83
US6977427B2Dec 20, 2005

Electronic component having stacked semiconductor chips in parallel, and a method for producing the component

INFINEON TECHNOLOGIES AG14 citations83
US7265441B2Sep 4, 2007

Stackable single package and stacked multi-chip assembly

INFINEON TECHNOLOGIES AG13 citations82
US11469161B2Oct 11, 2022

Lead frame-based semiconductor package

INFINEON TECHNOLOGIES AG1 citations61

HETZEL WOLFGANG

2 patents
US8624372B2Jan 7, 2014

Semiconductor component comprising an interposer substrate

HETZEL WOLFGANG6 citations70
US8072085B2Dec 6, 2011

Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same

HETZEL WOLFGANG3 citations60

SIEMENS AG

1 patent
US6075358AJun 13, 2000

Device in a semiconductor manufacturing installation in particular for integrated circuits

SIEMENS AG16 citations75

UTAC UNITED TEST AND ASSEMBLY TEST CT LTD

1 patent
US7851899B2Dec 14, 2010

Multi-chip ball grid array package and method of manufacture

UTAC UNITED TEST AND ASSEMBLY TEST CT LTD10 citations74