Inventor
KIM HYON-CHOL
KR6 patents
⚠️ This page may combine multiple inventors who share the name “KIM HYON-CHOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
4 patentsUS10431536B2Oct 1, 2019
Interposer substrate and semiconductor package
SAMSUNG ELECTRONICS CO LTD53 citations92
US9048168B2Jun 2, 2015
Semiconductor packages having warpage compensation
SAMSUNG ELECTRONICS CO LTD7 citations83
US10546844B2Jan 28, 2020
Stack package and method of manufacturing the stack package
SAMSUNG ELECTRONICS CO LTD15 citations82
US9040351B2May 26, 2015
Stack packages having fastening element and halogen-free inter-package connector
SAMSUNG ELECTRONICS CO LTD4 citations72