Inventor
TAKE NAOYA
US19 patents
⚠️ This page may combine multiple inventors who share the name “TAKE NAOYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOYOTA ENG & MFG NORTH AMERICA
14 patentsUS10505106B1Dec 10, 2019
Encapsulated PCM switching devices and methods of forming the same
TOYOTA ENG & MFG NORTH AMERICA20 citations93
US10515871B1Dec 24, 2019
Cooling devices having large surface area structures, systems incorporating the same, and methods of forming the same
TOYOTA ENG & MFG NORTH AMERICA7 citations83
US11101193B2Aug 24, 2021
Power electronics modules including integrated jet cooling
TOYOTA ENG & MFG NORTH AMERICA2 citations73
US10830544B2Nov 10, 2020
Self-healing metal structures
TOYOTA ENG & MFG NORTH AMERICA5 citations72
US10804236B2Oct 13, 2020
Power electronic assemblies with high purity aluminum plated substrates
TOYOTA ENG & MFG NORTH AMERICA3 citations72
US10743442B2Aug 11, 2020
Cooling devices including jet cooling with an intermediate mesh and methods for using the same
TOYOTA ENG & MFG NORTH AMERICA3 citations72
US10490482B1Nov 26, 2019
Cooling devices including jet cooling with an intermediate mesh and methods for using the same
TOYOTA ENG & MFG NORTH AMERICA4 citations72
US11121061B2Sep 14, 2021
Cooling chip structures having a jet impingement system and assembly having the same
TOYOTA ENG & MFG NORTH AMERICA0 citations62
US10896865B2Jan 19, 2021
Power electronics modules including an integrated cooling channel extending through an electrically-conductive substrate
TOYOTA ENG & MFG NORTH AMERICA0 citations62
US10700036B2Jun 30, 2020
Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
TOYOTA ENG & MFG NORTH AMERICA1 citations62
US10903186B2Jan 26, 2021
Power electronic assemblies with solder layer and exterior coating, and methods of forming the same
TOYOTA ENG & MFG NORTH AMERICA0 citations51
US10879209B2Dec 29, 2020
Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
TOYOTA ENG & MFG NORTH AMERICA0 citations51
US10861816B2Dec 8, 2020
Electronic assemblies having a mesh bond material and methods of forming thereof
TOYOTA ENG & MFG NORTH AMERICA0 citations51
US10818576B2Oct 27, 2020
Methods of forming power electronic assemblies using metal inverse opals and cap structures
TOYOTA ENG & MFG NORTH AMERICA0 citations49
TOYOTA MOTOR CO LTD
4 patentsUS10727146B2Jul 28, 2020
Semiconductor device
TOYOTA MOTOR CO LTD3 citations66
US10332852B2Jun 25, 2019
Semiconductor device
TOYOTA MOTOR CO LTD0 citations51
US10312211B2Jun 4, 2019
Method of manufacturing semiconductor device
TOYOTA MOTOR CO LTD0 citations41
US10153241B2Dec 11, 2018
Semiconductor device and method of manufacturing the same
TOYOTA MOTOR CO LTD0 citations41