P

Inventor

TAKE NAOYA

US19 patents
⚠️ This page may combine multiple inventors who share the name “TAKE NAOYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOYOTA ENG & MFG NORTH AMERICA

14 patents
US10505106B1Dec 10, 2019

Encapsulated PCM switching devices and methods of forming the same

TOYOTA ENG & MFG NORTH AMERICA20 citations93
US10515871B1Dec 24, 2019

Cooling devices having large surface area structures, systems incorporating the same, and methods of forming the same

TOYOTA ENG & MFG NORTH AMERICA7 citations83
US11101193B2Aug 24, 2021

Power electronics modules including integrated jet cooling

TOYOTA ENG & MFG NORTH AMERICA2 citations73
US10830544B2Nov 10, 2020

Self-healing metal structures

TOYOTA ENG & MFG NORTH AMERICA5 citations72
US10804236B2Oct 13, 2020

Power electronic assemblies with high purity aluminum plated substrates

TOYOTA ENG & MFG NORTH AMERICA3 citations72
US10743442B2Aug 11, 2020

Cooling devices including jet cooling with an intermediate mesh and methods for using the same

TOYOTA ENG & MFG NORTH AMERICA3 citations72
US10490482B1Nov 26, 2019

Cooling devices including jet cooling with an intermediate mesh and methods for using the same

TOYOTA ENG & MFG NORTH AMERICA4 citations72
US11121061B2Sep 14, 2021

Cooling chip structures having a jet impingement system and assembly having the same

TOYOTA ENG & MFG NORTH AMERICA0 citations62
US10896865B2Jan 19, 2021

Power electronics modules including an integrated cooling channel extending through an electrically-conductive substrate

TOYOTA ENG & MFG NORTH AMERICA0 citations62
US10700036B2Jun 30, 2020

Encapsulated stress mitigation layer and power electronic assemblies incorporating the same

TOYOTA ENG & MFG NORTH AMERICA1 citations62
US10903186B2Jan 26, 2021

Power electronic assemblies with solder layer and exterior coating, and methods of forming the same

TOYOTA ENG & MFG NORTH AMERICA0 citations51
US10879209B2Dec 29, 2020

Encapsulated stress mitigation layer and power electronic assemblies incorporating the same

TOYOTA ENG & MFG NORTH AMERICA0 citations51
US10861816B2Dec 8, 2020

Electronic assemblies having a mesh bond material and methods of forming thereof

TOYOTA ENG & MFG NORTH AMERICA0 citations51
US10818576B2Oct 27, 2020

Methods of forming power electronic assemblies using metal inverse opals and cap structures

TOYOTA ENG & MFG NORTH AMERICA0 citations49

TOYOTA MOTOR CO LTD

4 patents

DENSO CORP

1 patent