Inventor

TANG JINBANG

US40 patents

⚠️ This page may combine multiple inventors who share the name “TANG JINBANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TANG JINBANG

FREESCALE SEMICONDUCTOR INC

Methods and apparatus for EMI shielding in multi-chip modules

Electromagnetic shield formation for integrated circuit die package

Integrated circuit module with integrated passive device

Radiation shielded module and method of shielding microelectronic device

Integrated conformal shielding method and process using redistributed chip packaging

Integrated circuit module and method of packaging same

Method for forming a packaged semiconductor device

Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound

Electronic device including dies, a dielectric layer, and a encapsulating layer

Integrated circuit module and method of packaging same

Method of forming a high thermal conducting semiconductor device package

Shielded multi-layer package structures

Method and apparatus for mini module EMI shielding evaluation

Electronic device including a conductive stud over a bonding pad region

Electrically conductive barriers for integrated circuits

Shielding structures for signal paths in electronic devices

Antenna assembly for wafer level packaging

TANG JINBANG

Method of manufacting an electronic device module with integrated antenna structure

Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer

Microelectronic assembly with an embedded waveguide adapter and method for forming the same

Packaging millimeter wave modules

Method of making an integrated circuit package with shielding via ring structure

Electronic device module with integrated antenna structure, and related manufacturing method

Shielding for a micro electro-mechanical device and method therefor

Microelectronic assembly with an embedded waveguide adapter and method for forming the same

Methods for forming a micro electro-mechanical device

Calibration standards and methods of their fabrication and use

Shielding structures for signal paths in electronic devices

NXP USA INC

Compact connectors with integrated wireless communication elements

Semiconductor device assembly and method therefor

Semiconductor device assembly and method therefor

Semiconductor device assembly and method therefor

Packaged pressure sensor device

Packaged pressure sensor device

Waveguide launcher in package based on high dielectric constant carrier

High dielectric constant carrier based packaging with enhanced WG matching for 5G and 6G applications

Integrated radio package having a built-in multi directional antenna array

Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process

Semiconductor device having corrugated leads and method for forming

RAMANATHAN LAKSHMI N

Process of forming an electronic device including a conductive stud over a bonding pad region