Inventor

LUO HAILONG

CN21 patents

⚠️ This page may combine multiple inventors who share the name “LUO HAILONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LUO HAILONG

NINGBO SEMICONDUCTOR INT CORP

Packaging method and packaging structure of film bulk acoustic resonator

Wafer-level packaging method and package structure thereof

Wafer-level packaging method and package structure thereof

Thin film piezoelectric acoustic wave resonator and manufacturing method therefor, and filter

Bulk acoustic wave resonator, filter and radio frequency communication system

Fabrication method of photodetector and imaging sensor

Wafer-level package structure

Wafer-level package structure

Package structure of wafer-level system-in-package

Photodetector and fabrication method, and imaging sensor

Wafer-level packaging method and package structure

Wafer-level system-in-package packaging method and package structure thereof

Wafer-level packaging method and package structure thereof

Wafer-level system packaging method and package structure

Manufacturing method of a composite substrate of an acoustic wave resonator

Wafer level package structure and wafer level packaging method

Packaging method and packaging structure of FBAR

Mask plate and fabrication method thereof

Packaging method and package structure of wafer-level system-in-package

NINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH

Packaging module and packaging method of BAW resonator

Packaging method of a film bulk acoustic resonator