Inventor

TSAI HAO-YI

TW435 patents

⚠️ This page may combine multiple inventors who share the name “TSAI HAO-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI HAO-YI

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor packages and methods of forming the same

Package structures and method of forming the same

Semiconductor package and manufacturing method thereof

Integrated fan-out stacked package with fan-out redistribution layer (RDL)

Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors

Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating process

Integrated fan-out (InFO) package structures and methods of forming same

Semicondcutor package and method of manufacturing the same

Wireless charging package with chip integrated in coil center

Integrated circuit package and method

Dummy dies for reducing warpage in packages

Package structure and method of forming the same

Semiconductor package and method

Sensor package and method

Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors

Package structure

Semiconductor structure and method of fabricating the same

Chip package and method of forming the same

Integrated fan-out device, 3D-IC system, and method

Integrated circuit package and method

Multi-chip semiconductor package

Semiconductor device and method

Semiconductor package and manufacturing process thereof

Chip package and method of forming the same

Fan out package structure and method of manufacturing the same

Dual-mode wireless charging device

Semiconductor structure with conductive structure

Semiconductor package and manufacturing process thereof

Fingerprint sensor device and method

Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors

Wireless charging package with chip integrated in coil center

Method of manufacturing a semiconductor structure

Package structure and method of fabricating the same

InFO coil on metal plate with slot

Polymer based-semiconductor structure with cavity

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

System and method for an improved interconnect structure

Structure for reducing integrated circuit corner peeling

Method and apparatus for enhanced CMP planarization using surrounded dummy design

Heat spreader structures in scribe lines

Semiconductor interconnect air gap formation process

Metal electrical fuse structure

Method for forming high reliability bump structure

Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling

Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling

JENG SHIN-PUU

Seal ring structure with improved cracking protection

Protective seal ring for preventing die-saw induced stress

Methods of die sawing

SHAO TUNG-LIANG

Apparatus and methods for forming through vias

TSAI HAO-YI

Bump pad structure