Inventor

KUO HUNG-YI

TW151 patents

⚠️ This page may combine multiple inventors who share the name “KUO HUNG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUO HUNG-YI

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated fan-out (InFO) package structures and methods of forming same

Wireless charging package with chip integrated in coil center

Semiconductor package and method

Semiconductor structure and method of fabricating the same

Multi-chip semiconductor package

Semiconductor device and method

Dual-mode wireless charging device

Wireless charging package with chip integrated in coil center

Method of manufacturing a semiconductor structure

InFO coil on metal plate with slot

Semiconductor structure and manufacturing method thereof

Polymer based-semiconductor structure with cavity

Capacitor in post-passivation structures and methods of forming the same

Photonic package and method of manufacture

Photonic integrated circuit and package structure

Semiconductor device and method

Multi-chip semiconductor package

Semiconductor structure and method of fabricating the same

Package and method of forming same

Semiconductor devices and methods of manufacture

Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap

Multi-chip semiconductor package

Semiconductor device having a heat dissipation structure connected chip package

Package structure, package-on-package structure and method of fabricating the same

Semiconductor devices and methods of forming the same

Semiconductor device and method

Semiconductor package and method

InFO coil on metal plate with slot

Semiconductor structure

Wireless charging package with chip integrated in coil center

Hexagonal semiconductor package structure

Stacked coil for wireless charging structure on InFO package

Method for manufacturing semiconductor structure

Fan-out package structure, antenna system and associated method

Semiconductor structure and manufacturing method thereof

Capacitor in post-passivation structures and methods of forming the same

VIA TECH INC

Power management method of north bridge

Power management system with a bridge logic having analyzers for monitoring data quantity to modify operating clock and voltage of the processor and main memory

Bus interface timing adjustment device, method and application chip

Method and related apparatus for calibrating signal driving parameters between chips

Digital temperature detecting system and method

YU CHIH-KUANG

Methods of fabricating light emitting diode packages

Wafer level photonic device die structure and method of making the same

Methods of fabricating light emitting diode packages

TAIWAN SEMICONDUCTOR MFG

3D package with through substrate vias

Semiconductor devices having guard ring structure and methods of manufacture thereof

Single mask package apparatus and method

CHEM CHYI SHYUAN

Method of forming a light emitting diode emitter substrate with highly reflective metal bonding

TSAI HAO-YI

Inductor for post passivation interconnect

HSIA SHOULI STEVE

LED structure having embedded zener diode