Inventor

YU TSUNG-YUAN

TW109 patents

⚠️ This page may combine multiple inventors who share the name “YU TSUNG-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YU TSUNG-YUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device and manufacturing method thereof

Capacitor in post-passivation structures and methods of forming the same

Finfet seal ring

Semiconductor package and method of manufacturing the same

Photonic integrated circuit and package structure

Semiconductor devices and methods of manufacture

Package structure, package-on-package structure and method of fabricating the same

Semiconductor devices and methods of forming the same

Semiconductor device

Interconnect structures and methods of forming same

Packaging devices and methods of manufacture thereof

System and method for an improved interconnect structure

Capacitor in post-passivation structures and methods of forming the same

Packaging devices, methods of manufacture thereof, and packaging methods

Packaging devices and methods of manufacture thereof

Interconnect structures and methods of forming same

Packaging devices, methods of manufacture thereof, and packaging methods

Semiconductor device and manufacturing method thereof

Package structure and method of forming the same

Packaging devices and methods of manufacture thereof

Die stacking structure and method forming same

Interconnect structures and methods of forming same

Semiconductor device and manufacturing method thereof

Inductor system and method

Semiconductor devices with ball strength improvement

Inductor system and method

TAIWAN SEMICONDUCTOR MFG

System and method for an improved interconnect structure

Interconnect structures and methods of forming same

Methods and apparatus for wafer level packaging

Packaging devices and methods of manufacture thereof

Methods and apparatus of packaging of semiconductor devices

Semiconductor device and method of manufacturing the same

3D package with through substrate vias

Method of forming bump structure

Semiconductor devices having guard ring structure and methods of manufacture thereof

Semiconductor device with post-passivation interconnect structure and method of forming the same

Method of making a semiconductor device having a post-passivation interconnect structure

Chip package and method of manufacturing the same

Methods and apparatus for wafer level packaging

Semiconductor package device and forming the same

Ball amount process in the manufacturing of integrated circuit

Packaging devices and methods of manufacture thereof

Capacitor in post-passivation structures and methods of forming the same

Capacitor in post-passivation structures and methods of forming the same

Capacitor in Post-Passivation structures and methods of forming the same

LIANG SHIH-WEI

Post-passivation interconnect structure

CHEN HSIEN-WEI

Uniformity control for IC passivation structure

TSAI HAO-YI

Inductor for post passivation interconnect

YANG CHUNG-YING

Wafer level chip scale package and method of manufacturing the same

CHEN YING-JU

Bond pad structure to reduce bond pad corrosion